Company strength
Use technological innovation to enhance the international competitiveness of China's manufacturing industry
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Manufacturing

Manufacturing strength

 

  • Capable of processing single-sided, double-sided and multi-layer PCBA
  • Capable of conducting fully implement of lead-free and ROSH process
  • Capable of processing components with a pitch of 0.3mm
  • Mounting capability of BGA with 0.3mm 256 balls pitch
  • Capability of completing placement of 0201 chip components
  • Ability to implement online and off-line programming
  • Plan designing and implementation of automatic assembly

 

  • Ability to control the spraying of the 200u-thick conformal coating
  • Capable of automatically pouring glue (epoxy resin, silica gel) to cover PCBA to gain waterproof ability
  • Ability to develop automatic test function and customizing programming.
  • Pulse ultrasonic welding capability
  • AOI inspection and 2D X-Ray scanning inspection and analysis capabilities
  • Offline SPC, PFMEA/DFMEAQCP/APQP, PPAP, PDCA
  • Product MES tracking system (Reduce version at ICT & FCT)
  • Updating Manufacturing Management System SMD/Change-Over, Kanban, T/T

 

  • Product MES tracking system (Reduce version at ICT & FCT)
  • Updating Manufacturing Management System SMD/Change-Over, Kanban, T/T
  • ESD Management System (Apply ESD S20.20)
  • S (5S + Safety)
  • IPC standards (Certified IPC-A-610D, IPC-7711/7721)
  • MSA & CpkCmk Study
  • Offline SPC, PFMEA/DFMEAQCP/APQP, PPAP, PDCA
  • Laser marking and engraving capabilities
  • Smart warehouse & AGV logistics
  • Constant temperature and humidity workshop
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