Manufacturing strength
- Capable of processing single-sided, double-sided and multi-layer PCBA
- Capable of conducting fully implement of lead-free and ROSH process
- Capable of processing components with a pitch of 0.3mm
- Mounting capability of BGA with 0.3mm 256 balls pitch
- Capability of completing placement of 0201 chip components
- Ability to implement online and off-line programming
- Plan designing and implementation of automatic assembly
- Ability to control the spraying of the 200u-thick conformal coating
- Capable of automatically pouring glue (epoxy resin, silica gel) to cover PCBA to gain waterproof ability
- Ability to develop automatic test function and customizing programming.
- Pulse ultrasonic welding capability
- AOI inspection and 2D X-Ray scanning inspection and analysis capabilities
- Offline SPC, PFMEA/DFMEAQCP/APQP, PPAP, PDCA
- Product MES tracking system (Reduce version at ICT & FCT)
- Updating Manufacturing Management System SMD/Change-Over, Kanban, T/T
- Product MES tracking system (Reduce version at ICT & FCT)
- Updating Manufacturing Management System SMD/Change-Over, Kanban, T/T
- ESD Management System (Apply ESD S20.20)
- S (5S + Safety)
- IPC standards (Certified IPC-A-610D, IPC-7711/7721)
- MSA & CpkCmk Study
- Offline SPC, PFMEA/DFMEAQCP/APQP, PPAP, PDCA
- Laser marking and engraving capabilities
- Smart warehouse & AGV logistics
- Constant temperature and humidity workshop
STRENGTH
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