Manufacturing strength
- Capable of Processing Single-sided, Double-sided and Multi-layer PCBA
- Capable of Conducting Fully Implement of Lead-free and ROSH Process
- Capable of Processing Components with a pitch of 0.3mm
- Mounting Capability of BGA with 0.3mm 256 Balls Pitch
- Capability of Completing Placement of 0201 Chip Components
- Ability to Implement Online and Off-line Programming
- Plan Designing and Implementation of Automatic Assembly
- ↵Ability to Control the Spraying of the 200u-thick Conformal Coating
- Capable of Automatically Pouring Glue (epoxy resin, silica gel) to Cover PCBA to Gain Waterproof Ability
- Ability to Develop Automatic Test Function and Customizing Programming.
- Pulse Ultrasonic Welding Capability
- AOI Inspection and 2D X-Ray Scanning Inspection and Analysis Capabilities
- Offline SPC, PFMEA/DFMEAQCP/APQP, PPAP, PDCA
- Product MES Tracking System (Reduce version at ICT & FCT)
- Updating Manufacturing Management System SMD/Change-Over, Kanban, T/T
- Product MES tracking system (Reduce version at ICT & FCT
- Updating Manufacturing Management System SMD/Change-Over, Kanban, T/T
- ESD Management System (Apply ESD S20.20)
- S (5S + Safety)
- IPC standards (Certified IPC-A-610D, IPC-7711/7721)
- MSA & CpkCmk Study
- Offline SPC, PFMEA/DFMEAQCP/APQP, PPAP, PDCA
- Laser marking and engraving capabilities
- Smart warehouse & AGV logistics
- Constant temperature and humidity workshop
STRENGTH
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